Bondable Terminal Pads

Micron’s bondable terminals are specially designed for use in strain gage circuits. They are manufactured from 0.14 thick copper-clad epoxy glass. The epoxy glass ensures superior electrical insulation. These bondable terminals are flexible, strong, and capable of high temperatures up to 350° F continuous operation.

These bondable terminals are convenient junction points for connecting single or multiple strain gages to larger instrumentation leads. It has become common practice to employ bondable terminals between the main lead wires of larger diameter and the small delicate strain gage leads. The solder tab serves as a thermal barrier, permitting a higher temperature for the larger wire solder joint without loss of degradation to the strain gage leads. The primary purpose is to provide an anchor and thermal barrier for both sets of leads.

Note: Bondable terminal (Pads) rated at 450° F can be special ordered.

Micron offers different sizes of bondable terminals to suit varying transducer applications.