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RSGH Semiconductor Strain Gage Half-Bridge Rosettes
Piezo-Metrics' semiconductor strain gage half-bridge rosettes use the same surface preparation techniques, bonding procedures and electrical connection methods as those used for metal foil strain gage rosettes with the added advantage of having a Gage Factor (GF) that is up to 70 times greater than that of a standard metal foil strain gage. Two types of half-bridge rosettes are available, namely, the Bending-Load rosette and the Torque-Component rosette. Bend loads are measured using Gage 1 and Gage 2 on the Bend-Load rosette while Axial Loads are measured using Gage 3 and either Gage 1 or Gage 2. Torque loads are measured using Gage 1 and Gage 2 on the Torque-Component rosette while component strains are measured using Gages 1, 2 and 3 which are oriented at +45 deg/0 deg/-45 deg, respectively.
Key Specifications
- Rosette types: Bending-Load & Torque-Component
- Strain gages used: Piezo-Metrics Precision_Matched™ SC Semiconductor strain gages
- Gage resistance: 500 Ohms
- Rosette gage factor (GF): up to 70 times greater than metal foil gauges
- RSGH half-bridge rosette thermal matching: up to 4 individual rosettes
- Bending-Load configuration: Bend Loads measured using Gage 1 and Gage 2, Axial Loads measured using Gage 3 and either Gage 1 or Gage 2
- Torque-Component configuration: Torque loads measured using Gage 1 and Gage 2, Component strains measured using Gages 1, 2 and 3 oriented at +45 deg/0 deg/-45 deg